Buscador web

Choque Térmico

Cámara Choque Térmico TS 130

Temperature shock test chambers for simulating the high thermal values required by testing standards in the electronics industry which require building components to be exposed to changes in temperature from –80 to +220°C within seconds. The test specimens are placed in a lifting basket which is moved between the test rooms which are conditioned to different temperatures (hot and cold chamber).
Cámara Choque Térmico TS 60

El principal objetivo de los ensayos de choque térmico es la determinación de la influencia de los cambios rápidos de temperatura en las muestras de ensayo. El equipo consiste en dos cámaras controladas independientemente, una fría (-80ª a +70ºC) y otra caliente (+50ºC a +220ºC), situadas una encima de otra. El Choque Térmico se consigue transfiriendo las muestras de ensayo de una cámara a otra en pocos segundos (<10seg.). Se pueden programar diferentes tiempos de permanencia, así como el número de ciclos que las muestras deben sufrir todo el ciclo de choque térmico. Opción de programación y control del equipo con softwares S!MPATI.
Cámara de Choque Térmico TS 120

Our latest shock test chamber type TS 120 brings a fresh breeze into the field of environmental simulation. The modern appearance of this new system positions Weiss, once again, a step ahead of the rest. The smooth and continuous "evolution" of our products contra a hasty "revolution" has resulted in a system offering performance features that are far above standard.
Cámara de Choque Térmico TS 120/3

Our test system type TS 120/3 offers you many favourable advantages. Our positive experience gained from the 2-zone design has been integrated into this system e.g. the well-proven vertical arrangement of the test zones. Proxinity sensors ensure exact cradle position and guarantee perfect tightness between the individual zones and thus very low energy consumption. All test zones may be operated as individual systems. The middle zone allows the preconditioning and post conditioning of specimens.
Cámara de Choque Térmico TS 300

In addition to temperature stressing, extremely rapid temperature cycling rates in the range of -80 °C to +220 °C (-112 °F to +428 °F) result in an extremely high mechanical stress of test specimens. If electronic components are exposed to this rapid temperature cycling, weak points are revealed in a short time. By assigning our shock test chamber, you not only reduce the number of premature failures but also increase the reliability of your products. Our systems fulfill the requirements of internation testing standards such as DIN, IEC and MIL.